Multiple energization elements in stacked integrated component devices

ABSTRACT

This invention discloses a device comprising multiple functional layers with multiple energization elements formed on substrates, wherein at least one functional layer comprises an electrical energy source. In some embodiments, the present invention includes a component for incorporation into ophthalmic lenses that has been formed by the stacking of multiple functionalized layers.

RELATED APPLICATIONS

This application claims priority to U.S. Provisional Application Ser.No. 61/454,205 filed on Mar. 18, 2011; and U.S. Provisional ApplicationSer. No. 61/454,591 filed on Mar. 21, 2011; the contents of which arerelied upon and incorporated by reference.

FIELD OF USE

This invention describes a device formed from multiple functional layerswhich are stacked, wherein at least one layer includes a power source aswell as, in some embodiments, methods and apparatus for the fabricationof a stacked integrated component device based on multiple stackedlayers.

BACKGROUND

Traditionally an ophthalmic device, such as a contact lens, anintraocular lens or a punctal plug included a biocompatible device witha corrective, cosmetic or therapeutic quality. A contact lens, forexample, may provide one or more of: vision correcting functionality;cosmetic enhancement; and therapeutic effects. Each function is providedby a physical characteristic of the lens. A design incorporating arefractive quality into a lens may provide a vision corrective function.A pigment incorporated into the lens may provide a cosmetic enhancement.An active agent incorporated into a lens may provide a therapeuticfunctionality. Such physical characteristics are accomplished withoutthe lens entering into an energized state. A punctal plug hastraditionally been a passive device.

More recently, it has been theorized that active components may beincorporated into a contact lens. Some components may includesemiconductor devices. Some examples have shown semiconductor devicesembedded in a contact lens placed upon animal eyes. It has also beendescribed how the active components may be energized and activated innumerous manners within the lens structure itself. The topology and sizeof the space defined by the lens structure creates a novel andchallenging environment for the definition of various functionality.Generally, such disclosures have included discrete devices. However, thesize and power requirements for available discrete devices are notnecessarily conducive for inclusion in a device to be worn on a humaneye. Technological embodiments that address such an ophthalmologicalbackground need generate solutions that not only address ophthalmicrequirements but also encompass novel embodiments for the more generaltechnology space of powered electrical devices.

SUMMARY

Accordingly, the present invention includes designs of components thatmay be combined to form a stacked layer of substrates combined into adiscrete package. The stacked layers will include one or more layerswhich include a power source for at least one component included in thestacked layers. In some embodiments, an insert is provided that may beenergized and incorporated into an ophthalmic device. The insert may beformed of multiple layers which may have unique functionality for eachlayer; or alternatively mixed functionality but in multiple layers. Thelayers may in some embodiments have layers dedicated to the energizationof the product or the activation of the product or for control offunctional components within the lens body. In addition, methods andapparatus for forming an ophthalmic lens, with inserts of stackedfunctionalized layers are presented.

In some embodiments, the insert may contain a layer in an energizedstate which is capable of powering a component capable of drawing acurrent. Components may include, for example, one or more of: a variableoptic lens element, and a semiconductor device, which may either belocated in the stacked layer insert or otherwise connected to it.

In another aspect, some embodiments may include a cast molded siliconehydrogel contact lens with a rigid or formable insert of stackedfunctionalized layers contained within the ophthalmic lens in abiocompatible fashion, wherein at least one of the functionalized lensincludes a power source.

Accordingly, the present invention includes a disclosure of atechnological framework for devices formed from multiple stacked layerswith energization. In exemplary embodiments, disclosure is made for anophthalmic lens with a stacked functionalized layer portion, apparatusfor forming an ophthalmic lens with a stacked functionalized layerportion and methods for the same. An insert may be formed from multiplelayers in various manners as discussed herein and the insert may beplaced in proximity to one, or both of, a first mold part and a secondmold part. A reactive monomer mix is placed between the first mold partand the second mold part. The first mold part is positioned proximate tothe second mold part thereby forming a lens cavity with the energizedsubstrate insert and at least some of the reactive monomer mix in thelens cavity; the reactive monomer mix is exposed to actinic radiation toform an ophthalmic lens. Lenses may be formed via the control of actinicradiation to which the reactive monomer mixture is exposed.

DESCRIPTION OF THE DRAWINGS

FIG. 1 illustrates a mold assembly apparatus according to previouslydescribed embodiments.

FIG. 2 illustrates an exemplary embodiment of an exemplary form factorfor an insert which can be placed within an ophthalmic lens.

FIG. 3 illustrates a three dimensional representation of an insertformed of stacked functional layers which is incorporated within anophthalmic lens mold part.

FIG. 4 illustrates a cross sectional representation of an ophthalmiclens mold part with an insert.

FIG. 5 demonstrates an exemplary embodiment of an insert comprisingmultiple stacked functional layers upon a supporting and aligningstructure.

FIG. 6 illustrates different shapes and embodiments of the componentsused for forming layers in a stacked functional layer insert.

FIG. 7 illustrates a block diagram of some embodiments of a power sourcelayer.

FIG. 8 illustrate an exemplary embodiment of form factor for a wirebased power source.

FIG. 9 illustrates the shape of an exemplary wire based power sourcerelative to an exemplary ophthalmic lens component.

FIG. 10 illustrates a cross sectional diagram of the radial film layersof an exemplary wire based power source.

FIG. 11 illustrates an exemplary stacked integrate component device withcomponents from multiple technologies and energization sources.

FIG. 12 illustrates an exemplary circuit diagram for a stackedintegrated component device with multiple energization elements.

FIG. 13 illustrates an exemplary flexible power supply embodimentutilizing multiple energization elements.

FIG. 14 illustrates is a flowchart with exemplary method steps forself-diagnostic procedures for stacked integrated component devices withmultiple energization elements.

FIG. 15 illustrates an exemplary stacked integrated component devicewherein multiple energization elements are in operations for bothcharging and discharging.

DETAILED DESCRIPTION OF THE INVENTION

The present invention includes a substrate insert device formed throughthe stacking of multiple functionalized layers. Additionally the presentinvention includes methods and apparatus for manufacturing an ophthalmiclens with such a stacked functionalized layer substrate as an insert inthe formed lens. In addition, some embodiments of the present inventioninclude an ophthalmic lens with a stacked functionalized layer substrateinsert incorporated into the ophthalmic lens.

In the following sections detailed descriptions of embodiments of theinvention will be given. The description of both preferred andalternative embodiments are exemplary embodiments only, and it isunderstood that to those skilled in the art that variations,modifications and alterations may be apparent. It is therefore to beunderstood that said exemplary embodiments do not limit the scope of theunderlying invention.

GLOSSARY

In this description and claims directed to the presented invention,various terms may be used for which the following definitions willapply:

Energized: as used herein refers to the state of being able to supplyelectrical current to or to have electrical energy stored within.

Energy: as used herein refers to the capacity of a physical system to dowork. Many uses within this invention may relate to the said capacitybeing able to perform electrical actions in doing work.

Energy Source: as used herein refers to device or layer which is capableof supplying Energy or placing a logical or electrical device in anEnergized state.

Energy Harvesters: as used herein refers to device capable of extractingenergy from the environment and convert it to electrical energy.

Functionalized: as used herein refers to making a layer or device ableto perform a function including for example, energization, activation,or control.

Lens: refers to any ophthalmic device that resides in or on the eye.These devices may provide optical correction or may be cosmetic. Forexample, the term lens may refer to a contact lens, intraocular lens,overlay lens, ocular insert, optical insert or other similar devicethrough which vision is corrected or modified, or through which eyephysiology is cosmetically enhanced (e.g. iris color) without impedingvision. In some embodiments, the preferred lenses of the invention aresoft contact lenses are made from silicone elastomers or hydrogels,which include but are not limited to silicone hydrogels, andfluorohydrogels.

Lens forming mixture or “Reactive Mixture” or “RMM” (reactive monomermixture): as used herein refers to a monomer or prepolymer materialwhich may be cured and crosslinked or crosslinked to form an ophthalmiclens. Various embodiments may include lens forming mixtures with one ormore additives such as: UV blockers, tints, photoinitiators orcatalysts, and other additives one might desire in an ophthalmic lensessuch as, contact or intraocular lenses.

Lens Forming Surface: refers to a surface that is used to mold a lens.In some embodiments, any such surface 103-104 can have an opticalquality surface finish, which indicates that it is sufficiently smoothand formed so that a lens surface fashioned by the polymerization of alens forming material in contact with the molding surface is opticallyacceptable. Further, in some embodiments, the lens forming surface103-104 can have a geometry that is necessary to impart to the lenssurface the desired optical characteristics, including withoutlimitation, spherical, aspherical and cylinder power, wave frontaberration correction, corneal topography correction and the like aswell as any combinations thereof.

Lithium Ion Cell: refers to an electrochemical cell where Lithium ionsmove through the cell to generate electrical energy. Thiselectrochemical cell, typically called a battery, may be reenergized orrecharged in its typical forms.

Substrate insert: as used herein refers to a formable or rigid substratecapable of supporting an Energy Source within an ophthalmic lens. Insome embodiments, the Substrate insert also supports one or morecomponents.

Mold: refers to a rigid or semi-rigid object that may be used to formlenses from uncured formulations. Some preferred molds include two moldparts forming a front curve mold part and a back curve mold part.

Optical Zone: as used herein refers to an area of an ophthalmic lensthrough which a wearer of the ophthalmic lens sees.

Power: as used herein refers to work done or energy transferred per unitof time.

Rechargeable or Re-energizable: as used herein refers to a capability ofbeing restored to a state with higher capacity to do work. Many useswithin this invention may relate to the capability of being restoredwith the ability to flow electrical current at a certain rate for acertain, reestablished time period.

Reenergize or Recharge: To restore to a state with higher capacity to dowork. Many uses within this invention may relate to restoring a deviceto the capability to flow electrical current at a certain rate for acertain, reestablished time period.

Released from a mold: means that a lens is either completely separatedfrom the mold, or is only loosely attached so that it may be removedwith mild agitation or pushed off with a swab.

Stacked: as used herein means to place at least two component layers inproximity to each other such that at least a portion of one surface ofone of the layers contacts a first surface of a second layer. In someembodiments, a film, whether for adhesion or other functions may residebetween the two layers that are in contact with each other through saidfilm.

“Stacked Integrated Component Devices” as used herein and sometimesreferred to as “SIC-Devices”, refers to the product of packagingtechnologies that can assemble thin layers of substrates, which maycontain electrical and electromechanical devices, into operativeintegrated devices by means of stacking at least a portion of each layerupon each other. The layers may comprise component devices of varioustypes, materials, shapes, and sizes. Furthermore, the layers may be madeof various device production technologies to fit and assume variouscontours as it may be desired.

DESCRIPTION

An energized lens 100 with an embedded Substrate insert 111 may includean Energy Source 109, such as an electrochemical cell or battery as thestorage means for the energy and in some embodiments, encapsulation, andisolation of the materials comprising the Energy Source from anenvironment into which an ophthalmic lens is placed.

In some embodiments, a Substrate insert also includes a pattern ofcircuitry, components and Energy Sources 109. Various embodiments caninclude the Substrate insert locating the pattern of circuitry,components and Energy Sources 109 around a periphery of an optic zonethrough which a wearer of a lens would see, while other embodiments caninclude a pattern of circuitry, components and Energy Sources 109 whichare small enough to not adversely affect the sight of a contact lenswearer and therefore the Substrate insert can locate them within, orexterior to, an optical zone.

In general, according to embodiments previously described, a Substrateinsert 111 is embodied within an ophthalmic lens via automation whichplaces an Energy Source a desired location relative to a mold part usedto fashion the lens.

Molds

Referring now to FIG. 1, a diagram of an exemplary mold 100 for anophthalmic lens is illustrated with a Substrate insert 111. As usedherein, the terms a mold includes a form 100 having a cavity 105 intowhich a lens forming mixture 110 can be dispensed such that uponreaction or cure of the lens forming mixture, an ophthalmic lens of adesired shape is produced. The molds and mold assemblies 100 of thisinvention are made up of more than one “mold parts” or “mold pieces”101-102. The mold parts 101-102 can be brought together such that acavity 105 is formed between the molds parts 101-102 in which a lens canbe formed. This combination of mold parts 101-102 is preferablytemporary. Upon formation of the lens, the mold parts 101-102 can againbe separated for removal of the lens.

At least one mold part 101-102 has at least a portion of its surface103-104 in contact with the lens forming mixture such that upon reactionor cure of the lens forming mixture 110 that surface 103-104 provides adesired shape and form to the portion of the lens with which it is incontact. The same is true of at least one other mold part 101-102.

Thus, for example, in a preferred embodiment a mold assembly 100 isformed from two parts 101-102, a female concave piece (front piece) 102and a male convex piece (back piece) 101 with a cavity formed betweenthem. The portion of the concave surface 104 which makes contact withlens forming mixture has the curvature of the front curve of anophthalmic lens to be produced in the mold assembly 100 and issufficiently smooth and formed such that the surface of an ophthalmiclens formed by polymerization of the lens forming mixture which is incontact with the concave surface 104 is optically acceptable.

In some embodiments, the front mold piece 102 can also have an annularflange integral with and surrounding circular circumferential edge 108and extends from it in a plane normal to the axis and extending from theflange (not shown).

A lens forming surface can include a surface 103-104 with an opticalquality surface finish, which indicates that it is sufficiently smoothand formed so that a lens surface fashioned by the polymerization of alens forming material in contact with the molding surface is opticallyacceptable. Further, in some embodiments, the lens forming surface103-104 can have a geometry that is necessary to impart to the lenssurface the desired optical characteristics, including withoutlimitation, spherical, aspherical and cylinder power, wave frontaberration correction, corneal topography correction and the like aswell as any combinations thereof.

At 111, a Substrate insert is illustrated onto which an Energy Source109 may be placed. The Substrate insert 111 may be any receivingmaterial onto which an Energy Source 109 may be placed, in someembodiments may also include circuit paths, components and other aspectsuseful to use of the energy source. In some embodiments, the Substrateinsert 111 can be a clear coat of a material which be incorporated intoa lens when the lens is formed. The clear coat can include for example apigment as described below, a monomer or other biocompatible material.Additional embodiments can include a media comprising an insert, whichcan be either rigid or formable. In some embodiments, a rigid insert mayinclude an optical zone providing an optical property (such as thoseutilized for vision correction) and a non-optical zone portion. AnEnergy Source can be placed on one or both of the optic zone andnon-optic zone of the insert. Still other embodiments can include anannular insert, either rigid or formable or some shape which circumventsan optic zone through which a user sees.

Various embodiments also include placing an Energy Source 109 ontoSubstrate insert 111 prior to placement of the Substrate insert 111 intoa mold portion used to form a lens. The Substrate insert 111 may alsoinclude one or more components which will receive an electrical chargevia the Energy Source 109.

In some embodiments, a lens with a Substrate insert 111 can include arigid center soft skirt design in which a central rigid optical elementis in direct contact with the atmosphere and the corneal surface onrespective an anterior and posterior surfaces, wherein the soft skirt oflens material (typically a hydrogel material) is attached to a peripheryof the rigid optical element and the rigid optical element also acts asa Substrate insert providing energy and functionality to the resultingophthalmic lens.

Some additional embodiments include a Substrate insert 111 that is arigid lens insert fully encapsulated within a hydrogel matrix. ASubstrate insert 111 which is a rigid lens insert may be manufactured,for example using microinjection molding technology. Embodiments caninclude, for example, a poly(4-methylpent-1-ene) copolymer resin with adiameter of between about 6 mm to 10 mm and a front surface radius ofbetween about 6 mm and 10 mm and a rear surface radius of between about6 mm and 10 mm and a center thickness of between about 0.050 mm and 0.5mm. Some exemplary embodiments include an insert with diameter of about8.9 mm and a front surface radius of about 7.9 mm and a rear surfaceradius of about 7.8 mm and a center thickness of about 0.100 mm and anedge profile of about 0.050 radius. One exemplary micro-molding machinecan include the Microsystem 50 five-ton system offered by BattenfieldInc.

The Substrate insert can be placed in a mold part 101-102 utilized toform an ophthalmic lens.

Mold part 101-102 material can include, for example: a polyolefin of oneor more of: polypropylene, polystyrene, polyethylene, poly(methylmethacrylate), and modified polyolefins. Other molds can include aceramic or metallic material.

A preferred alicyclic co-polymer contains two different alicyclicpolymers and is sold by Zeon Chemicals L.P. under the trade name ZEONOR.There are several different grades of ZEONOR. Various grades may haveglass transition temperatures ranging from 105° C. to 160° C. Aspecifically preferred material is ZEONOR 1060R.

Other mold materials that may be combined with one or more additives toform an ophthalmic lens mold include, for example, Zieglar-Nattapolypropylene resins (sometimes referred to as znPP). An exemplaryZieglar-Natta polypropylene resin is available under the name PP 9544MED. PP 9544 MED is a clarified random copolymer for clean molding asper FDA regulation 21 CFR (c) 3.2 made available by Exxonmobil ChemicalCompany. PP 9544 MED is a random copolymer (znPP) with ethylene group(hereinafter 9544 MED). Other exemplary Zieglar-Natta polypropyleneresins include: Atofina Polypropylene 3761 and Atofina Polypropylene3620WZ.

Still further, in some embodiments, the molds of the invention maycontain polymers such as polypropylene, polyethylene, polystyrene,poly(methyl methacrylate), modified polyolefins containing an alicyclicmoiety in the main chain and cyclic polyolefins. This blend can be usedon either or both mold halves, where it is preferred that this blend isused on the back curve and the front curve consists of the alicyclicco-polymers.

In some preferred methods of making molds 100 according to the presentinvention, injection molding is utilized according to known techniques,however, embodiments can also include molds fashioned by othertechniques including, for example: lathing, diamond turning, or lasercutting.

Stacked Functionalized Layer Inserts

Referring now to FIG. 2, an exemplary design of one embodiment of aSubstrate insert 111 which has been formed as a Stacked FunctionalizedLayer Insert is illustrated. This invention relates to novel methods toprepare and form the substrate insert that may be utilized and formedinto Ophthalmic Lenses in manners consistent with the previouslydescribed art. For clarity of description, but not limiting the scope ofthe claimed invention, an exemplary Substrate insert 210 is illustratedand described, which comprises a full annular ring with an optical lensarea 211. It may be obvious to one skilled in the arts that theinventive art described in this specification has similar application tothe various diversity of shapes and embodiments that have been describedgenerically for Substrate inserts of various kinds.

Referring now to FIG. 3 a three dimensional representation isillustrated of some embodiments of a fully formed ophthalmic lens usinga stacked layer substrate insert of the type in item 210 is demonstratedas item 300. The representation shows a partial cut out from theophthalmic lens to realize the different layers present inside thedevice. Item 320 shows the body material in cross section of theencapsulating layers of the substrate insert. This item surrounds theentire periphery of the ophthalmic lens. It may be clear to one skilledin the arts that the actual insert may comprise a full annular ring orother shapes that still may reside within the constraints of the size ofa typical ophthalmic lens.

Items 330, 331 and 332 are meant to illustrate three of numerous layersthat may be found in a substrate insert formed as a stack of functionallayers. In some embodiments, a single layer may include one or more of:active and passive components and portions with structural, electricalor physical properties conducive to a particular purpose.

In some embodiments, a layer 330 may include an energization source,such as, for example, one or more of: a battery, a capacitor and areceiver within the layer 330. Item 331 then, in a non-limitingexemplary sense may comprise microcircuitry in a layer that detectsactuation signals for the ophthalmic lens. In some embodiments, a powerregulation layer 332, may be included that is capable of receiving powerfrom external sources, charges the battery layer 330 and controls theuse of battery power from layer 330 when the lens is not in a chargingenvironment. The power regulation may also control signals to anexemplary active lens, demonstrated as item 310 in the center annularcutout of the substrate insert.

An energized lens with an embedded Substrate insert may include anEnergy Source, such as an electrochemical cell or battery as the storagemeans for the energy and in some embodiments, encapsulation andisolation of the materials comprising the Energy Source from anenvironment into which an ophthalmic lens is placed.

In some embodiments, a Substrate insert also includes a pattern ofcircuitry, components and Energy Sources. Various embodiments mayinclude the Substrate insert locating the pattern of circuitry,components and Energy Sources around a periphery of an optic zonethrough which a wearer of a lens would see, while other embodiments mayinclude a pattern of circuitry, components and Energy Sources which aresmall enough to not adversely affect the sight of a contact lens wearerand therefore the Substrate insert may locate them within, or exteriorto, an optical zone.

In general, according to these embodiments previously described, aSubstrate insert 111 is embodied within an ophthalmic lens viaautomation which places an Energy Source a desired location relative toa mold part used to fashion the lens.

FIG. 4 illustrates a closer view of some embodiments of a stackedfunctional layer insert 400 seen in cross section. Within the body ofthe ophthalmic lens 410 is embedded the functionalized layer insert 420which surrounds and connects to an active lens component 450, in someembodiments. It may be clear to one skilled in the arts, that thisexample shows but one of numerous embodiments of embedded function thatmay be placed within an ophthalmic lens.

Within the stacked layer portion of the insert are demonstrated numerouslayers. In some embodiments the layers may comprise multiplesemiconductor based layers. For example, item 440, the bottom layer inthe stack, may be a thinned silicon layer upon which circuits have beendefined for various functions. Another thinned silicon layer may befound in the stack as item 441. In a non-limiting example, such a layermay have the function of energization of the device. These siliconlayers will in some embodiments be electrically isolated from each otherthrough an intervening insulator layer show as item 450. The portions ofthe surface layers of items 440, 450 and 441 that overlap each other maybe adhered to each other through the use of a thin film of adhesive. Itmay be obvious to one skilled in the arts that numerous adhesives mayhave the desired characteristics to adhere and passivate the thinsilicon layers to the insulator, as in an exemplary sense an epoxymight.

A multiple stacked layer may include additional layers 442, which in annon limiting example may include a thinned silicon layer with circuitrycapable of activating and controlling an active lens component. Asmentioned before, when the stacked layers need to be electricallyisolated from each other, stacked insulator layers may be includedbetween the electrically active layer and in this example item 451 mayrepresent this insulator layer comprising part of the stacked layerinsert. In some of the examples described herein, reference has beenmade to layers formed from thin layers of silicon. The general art maybe extended to different embodiments where the material definitions ofthe thin stacked layers include, in a non-limiting sense, othersemiconductors, metals or composite layers. And the function of the thinlayers may include electrical circuitry, but also may include otherfunctions like signal reception, energy handling and storage and energyreception to mention a few examples. In embodiments with differentmaterial types, the choice of different adhesives, encapsulants andother materials which interact with the stacked layers may be required.In an example embodiment, a thin layer of epoxy may adhere three siliconlayers shown as 440, 441 and 442 with two silicon oxide layers 450 and451.

As mentioned in some of the examples the thinned stacked layer maycomprise circuits formed into silicon layers. There may be numerousmanners to fabricate such layers, however, standard and state of the artsemiconductor processing equipment may form electronic circuits onsilicon wafers using generic processing steps. After the circuits areformed into the appropriate locations on the silicon wafers, waferprocessing equipment may be used to thin the wafers from hundreds ofmicrons thick to thicknesses of 50 microns or less. After thinning thesilicon circuits may be cut or “diced” from the wafer into theappropriate shapes for the ophthalmic lens or other application. Inlater section, different exemplary shapes of the stacked layer inventiondisclosed herein are shown in FIG. 6. These will be discussed in detaillater; however, the “dicing” operation may use various technical optionsto cut out thin layers with curved, circular, annular, rectilinear andother more complicated shapes.

When the stacked layers perform a function relating to electricalcurrent flow, in some embodiments, there may be a need to provideelectrical contact between the stacked layers. In the general field ofsemiconductor packaging this electrical connection between stackedlayers has generic solutions comprising wire bonding, solder bumping andwire deposition processes. Some embodiments of wire deposition may useprinting process where electrically conductive inks are printed betweentwo connection pads. In other embodiments, wires may be physicallydefined by an energy source, like for example a laser, interacting witha gaseous, liquid or solid chemical intermediate resulting in anelectrical connection where the energy source irradiates. Still furtherinterconnection definition embodiments may derive from photolithographicprocessing before or after metal films are deposited by various means.

In the invention herein, if one or more of the layers needs tocommunicate electrical signals outside itself, it may have a metalcontact pad that is not covered with passivating and insulating layers.In many embodiments these pads would be located on the periphery of thelayer where subsequent stacked layers do not cover the region. In anexample of this type of embodiment, in FIG. 4 interconnect wires 430 and431 are demonstrated as electrically connecting peripheral regions oflayers 440, 441 and 442. It may be apparent to one skilled in the artthat numerous layouts or designs of where the electrical connection padsare located and the manner of electrically connecting various padstogether. Furthermore, it may be apparent that different circuit designsmay derive from the choice of which electrical connect pads areconnected and to which other pads they are connected. Still further, thefunction of the wire interconnection between pads may be different indifferent embodiments including the functions of electrical signalconnection, electrical signal reception from external sources,electrical power connection and mechanical stabilization to mention afew examples.

In a previous discussion, it was presented that non semiconductor layersmay comprise one or more of the stacked layers in the inventive art. Itmay be apparent that there could be a great diversity of applicationswhich may derive from non-semiconductor layers. In some embodiments, thelayers may define energizing sources like batteries. This type of layerin some cases may have a semiconductor acting as the supportingsubstrate for the chemical layers, or in other embodiments may havemetallic or insulating substrates. Other layers may derive from layerswhich are primarily metallic in nature. These layers may defineantennas, thermal conductive paths, or other functions. There may benumerous combinations of semiconducting and non-semiconducting layersthat comprise useful application within the spirit of the inventive artherein.

In some embodiments where electrical connection is made between stackedlayers the electrical connection will need to be sealed after connectionis defined. There are numerous methods that may be consistent with theart herein. For example, the epoxy or other adherent materials used tohold the various stacked layers together could be reapplied to theregions with electrical interconnect. Additionally, passivation filmsmay, in some embodiments, be deposited across the entire device toencapsulate the regions that were used for interconnection. It may beapparent to one skilled in the art that numerous encapsulating andsealing schemes may be useful within this art to protect, strengthen andseal the stacked layer device and its interconnections andinterconnection regions.

Assembling Stacked Functionalized Layer Inserts

Proceeding to FIG. 5, item 500, a close up view of an exemplaryapparatus to assemble stacked functionalized layer inserts isdemonstrated. In the example, a stacking technique where the stackedlayers do not align on either side of the layer is shown. Items 440, 441and 442 again may be silicon layers. On the right side of the Fig. itmay be seen that the right side edge of the items 440, 441 and 442 donot align with each other, as they may in alternative embodiments. Sucha stacking methodology may allow the insert to assume a threedimensional shape similar to that of the general profile of anophthalmic lens. In some embodiments as well, such a stacking techniquemay allow for the layers to be made from the largest surface area aspossible. In layers that are functional for energy storage and circuitrysuch surface area maximization may be important.

In general many of the features of the previously described stackedinserts may be observed in FIG. 5 including stacked functional layers440, 441 and 442; stacked insulating layers 450 and 451; andinterconnections 430 and 431. Additionally a supporting jig, item 510,may be observed to support the stacked functionalized layer insert as itis being assembled. It may be apparent that the surface profile of item510 may assume a large number of shapes which will change the threedimensional shape of inserts made thereon.

In general, a jig 510 may be provided with a predetermined shape. It maybe coated with different layers, item 520, for a number of purposes. Ina non-limiting exemplary sense, the coating may first comprise a polymerlayer that will allow easy incorporation of an insert into the basematerial of an ophthalmic lens, and may even be formed from apolysilicone material in some embodiments. An epoxy coating may then bedeposited upon the polysilicone coating to adhere the bottom thinfunctional layer 440 to the coating 520. The bottom surface of a nextinsulating layer 450 may then be coated with a similar epoxy coating andthen placed into its appropriate location upon the jig. It may be clearthat the jig may in some embodiments have the function of aligning thecorrect placement of the stacked layers relative to each other as thedevice is assembled. In repetitious fashion, the rest of the insert maythen be assembled, the interconnections defined and then the insertencapsulated. In some embodiments, the encapsulated insert may then becoated from the top with a polysilicone coating. In some embodimentsthat use a polysilicone coating for item 520, the assembled insert maybe dissociated from the jig 510 by hydration of the polysiliconecoating.

The jig 510 may be formed from numerous materials. In some embodiments,the jig may be formed and made of similar materials that are used tomake molding pieces in the manufacture of standard contact lenses. Sucha use could support the flexible formation of various jig types fordifferent insert shapes and designs. In other embodiments the jig may beformed from materials that either in their own right or with specialcoatings will not adhere to the chemical mixtures used to adhere thedifferent layers to each other. It may be apparent that numerous optionsmay exist for the configuration of such a jig.

Another aspect of the jig demonstrated as item 510 is the fact that itsshape physically supports the layers upon it. In some embodiments theinterconnection between the layers may be formed by wire bondingconnection. In the process of wire bonding significant force is appliedthe wire to ensure it forms a good bond. Structural support of thelayers during such bonding could be important and could be performed bythe supporting jig 510.

Still another function of the jig demonstrated as item 510 is that thejig may have alignment features on it that allow for the alignment ofpieces of the functionalized layers to be aligned both relative to eachother linearly and radially along the surfaces. In some embodiments, thejig may allow the alignment of azimuthal angle of the functional layersrelative to each other around a center point. Regardless of the ultimateshape of the insert produced it may be apparent that the assembly jibmay be useful in insuring that the pieces of the insert are properlyaligned for their function and correct interconnection.

Proceeding to FIG. 6, a more generalized discussion of shapes of stackedlayer inserts may be had. In a subset of the generality of shapesconsistent with the art, some sample variation in shape is shown. Forexample, item 610 shows a top view of a stacked insert which has beenformed from essentially circular layer pieces. In some embodiments, theregion shown with cross hatching 611 may be an annular region wherelayer material has been removed. However, in other embodiments, it maybe apparent that the pieces of the stacked layers used form the insertcould be disks without an annular region. Although, such a non-annularinsert shape may be of limited utility in an ophthalmic application thespirit of the inventive art herein is not intended to be limited by thepresence of an internal annulus.

Item 620 may in some embodiments demonstrate different embodiments of astacked functional layer insert. As shown in item 621, in someembodiments the layer pieces may be discrete not only in the stackingdirection but also around the azimuthal direction perpendicular to thestacking direction. In some embodiments, semicircular pieces may be usedto form the insert. It may be apparent that in shapes that have anannular region, which partial shapes could be useful to reduce theamount of material that would need to be “diced” or cut out after thelayer material is formed into its function.

Proceeding further, item 630 demonstrates that non radial,non-elliptical and non-circular insert shapes could be defined. As shownin item 630, rectilinear shapes may be formed, or as in item 640 otherpolygonal shapes. In a three dimensional perspective pyramids, cones andother geometrical shapes could result from the different shapes of theindividual layer pieces used to form the insert. In the threedimensional perspective it may be noted that the individual layers whichhave heretofore been represented as planar or flat layer piecethemselves may assume degrees of freedom in three dimensions. When thesilicon layers are thinned sufficiently they are able to bend or contortaround their typical flat planar shape. This additional degree offreedom for thin layers allows for even further diversity of shapes thatmay be formed with stacked integrated component devices.

In a more general sense it may be apparent to one skilled in the artsthat a vast diversity of component shapes may be formed into deviceshapes and products to make stacked integrated component devices, andthese devices may assume a wide diversity of functionality, including ina non-limiting sense energization, signal sensing, data processing,communications both wired and wireless, power management,electromechanical action, control of external devices and the broaddiversity of function that layered components may provide.

Powered Layers

Referring now to FIG. 7, item 700, in some embodiments, one or morelayers of a functionalized stack of substrates may include a thin filmelectrical power source, 706. The thin electrical power source may beviewed essentially as a battery on a substrate.

A thin film battery (sometimes referred to as a TFB) may be structuredon a suitable substrate, such as silicon, using known depositionprocesses to deposit materials in thin layers or films. In someembodiments the deposition process for one of these thin film layers mayinclude, sputter deposition and may be used to deposit variousmaterials. After a film is deposited, it may be processed before a nextlayer is deposited. A common process on a deposited film may includelithography or masking techniques that then allow etching or othermaterial removing techniques to be performed thus allowing the filmlayer to have a physical shape in the two dimensions of the substratesurface.

In FIG. 7, item 700 an exemplary thin film processing flow may bedepicted. A thin film battery will typically be built upon a substrate,in this flow the substrate is depicted in an exemplary sense as anAluminum Oxide (Al₂O₃), item 701. A typical layer for electrical contactmay next be deposited upon the substrate as shown in the FIG. 7 as item702 where a cathode contact may be formed by a thin film deposition ofTitanium and Gold upon the substrate. As may be apparent in FIG. 7 thisfilm may then be patterned and etched, for example by a sputter etchtechnique or a wet etch technique to yield the shape as shown in item702. A next step in an exemplary process would be to form the cathodelayer as a film upon the cathode contact, item 703. One of the commonlyutilized cathode films may include Lithium Cobalt Oxide (LiCoO₂) and asshown in FIG. 7, it too may have patterning processes performed upon it.A next step, as shown as item 704, may be to deposit a thin film to forman electrolyte layer in the battery. There may be numerous materialchoices and forms for the electrolyte layer, but in an exemplary sense apolymer layer of Lithium Phosphorous OxyNitride (LiPON) may be used.Proceeding further to item 705, the thin film stack may be furtherprocessed with a deposition of Lithium for an anode layer and then acopper layer to act as the anode contact layer and like the other layersthen imaged for an appropriate shape for contact features or othersimilar features. The thin film battery may in some embodiments then berealized by encapsulating the film stack in passivation and sealinglayers. In exemplary fashion, the layers may be encapsulated withParylene and Titanium or with Epoxy and Glass layers as shown in item706. As with other layers there may be patterning and etching of thesefinal layers, for example to expose features where the encapsulatedbattery may be electrically contacted to. It may be apparent to oneskilled in the art, that there are an abundant set of material choicesfor each of the layers that may define embodiments within the spirit ofthe art disclosed herein.

As described for item 706, some embodiments will include enclosure inpackaging to preventingress of one or more of: oxygen, moisture, othergasses and liquids. These embodiments may therefore include packaging inone or more layers which may include one or more of an insulating layer,which as a non-limiting may include for example parylene, and animpermeable layer, which may include for example metals, aluminum,titanium, and similar materials which form an impermeable film layer. Anexemplary means of forming these layers may include application bydeposition onto a formed thin film battery device. Other methods offorming these layers may include applying organic materials, as forexample epoxy, in conjunction with pre-shaped impermeable materials. Insome embodiments the preshaped impermeable material may include the nextlayer of the integrated component device stack. In other embodiments theimpermeable material may include a precision formed/cut glass, alumina,or silicon cover layer.

In some embodiments, such as for example, a stacked integrated componentdevice for an ophthalmic device; a substrate may include one that isable to withstand high temperatures, as for example 800 deg. C., withoutchemical change. Some substrates may be formed from material whichprovides electrical insulation and alternatively some substrates may beelectrically conductive or semi-conductive. These alternative aspects ofthe substrate material, nonetheless, may be consistent with a final thinfilm battery that may form a thin component which may be integrated intoa stacked integrated component device and provide at least in part theenergization function of the device.

In some embodiments of a thin film battery where the thin film batteryis a thin component of a stacked integrated device, the battery may haveconnection to the other thin components through access with opening inthe passivation films at the contact pads shown as items 750 on item 706of FIG. 7 item 700. In additional embodiments, contact may be madethrough contact pads on the reverse side of the substrate from thatshown for items 750. Contact pads on the reverse side could beelectrically connected to the thin film battery through the use of a viathat is formed through the substrate which has a conductive material onthe via sidewalls or filling the via. Finally, there may also beembodiments where both contact pads on the top and bottom of thesubstrate are formed. Some of these contact pads may intersect thecontact pads of the thin film battery, but alternative embodiments mayinclude contact pads through the substrate where no connection is madeto the battery. As may be apparent to one skilled in the arts, there maybe numerous manners to interconnect through and to interconnect within asubstrate upon which a thin film battery is formed.

A set of differing embodiments of the art presented herein may relate tothe functions that the electrical connections may perform. Someinterconnections may provide an electrical connection path forcomponents within the stack of integrated component devices and theirinterconnection with devices outside the integrated component devicestack. In some of the embodiments that relate to connection outside ofthe device stack, this connection is made via a direct electricalconduction path. Still other embodiments derive when the connectionoutside of the package is made in a wireless manner; wherein theconnection is made through a manner including radio frequencyconnection, capacitive electrical communication, magnetic coupling,optical coupling or another of the numerous means that define manners ofwireless communication.

Wire Formed Power Source

Referring now to FIG. 8, an exemplary design of some embodiments of apower source, item 800, which includes a battery, 810, formed about aconductive wire, 820, are depicted. In some embodiments, item 820 mayinclude a fine gauge copper wire, which may be used as a support.Various battery component layers, which schematically are demonstratedas the rings evident in item 810, may be built up using batch orcontinuous wire coating processes. In this manner, a very highvolumetric efficiency, which may in some embodiments reach or exceed 60%of active battery materials, can be achieved in a convenient form factorthat is flexible. In some embodiments, a thin wire may be utilized toform small batteries, such as, in a non-limiting example, a batterywhose stored energy may include a range measured by milliamp hours. Thevoltage capability, in some embodiments of such a wire based batterycomponent, may be approximately 1.5 volts. It may be apparent to askilled artisan, that larger batteries and higher voltages may also bescaled, for example by designing the end device to connect singlebatteries in parallel or in series. The numerous manners in which theinventive art may be used to create useful battery devices are withinthe scope of the present invention.

Referring to FIG. 9, item 900, a depiction of how a wire based batterycomponent may be combined with other components to create embodiments ofthe inventive art is made. In an example, item 910 may represent anophthalmic device whose function may be controlled or altered byelectrical means. When such a device is part of a contact lens, thephysical dimensions that components occupy may define a relatively smallenvironment. Nevertheless, a wire based battery; item 920 may have anideal form factor for such an embodiment, existing on the periphery ofsuch an optical component in a shape that a wire may be formed into.

Referring now to FIG. 10, item 1000, the result of processing using anexemplary method for forming wire batteries is illustrated. Thesemethods and the resulting products define some embodiments of a wirebased battery. Initially, a copper wire, item 1010, of high purity suchas those available from a commercial source, for example McMaster CarrCorp. may be chosen and then coated with one or more layers. It may beapparent that there exist numerous alternative choices of the type andcomposition of the wire that may be used to form wire based batteries.

In some embodiments, a zinc anode coating may be used to define an anodefor the wire battery as shown as item 1020. The anode coating may beformulated from zinc metal powder, polymer binders, solvents, andadditives. The coating may be applied and immediately dried. In someembodiments, multiple passes of the same coating may be used to achievea desired thickness.

Continuing with FIG. 10, the anode and cathode of the wire battery maybe separated from each other. A separator coating, item 1030, may beformulated from non-conductive filler particles, polymer binders,solvents, and additives. In some embodiments the method of applicationof the separator may be a coating application method similar to thatused to coat the anode layer 1020.

A next step in processing the exemplary wire battery of item 1000 isforming a cathode layer. In some embodiments this cathode, item 1040 maybe formed with silver oxide cathode coating. This silver oxide coatingmay be formulated from Ag₂O powder, graphite, polymer binders, solvents,and additives. In similar fashion to the separator layer a commoncoating application method may be used as was used for other layers ofthe wire battery.

After a collector is formed, the exemplary wire battery may be coatedwith a layer to collect current from the cathode layer. In someembodiments, this layer may be a conductive layer from a carbonimpregnated adhesive. In other embodiments, this layer may be a metal,for example Silver, impregnated adhesive. It may be apparent to oneskilled in the art that there are numerous materials that may supportforming a layer to enhance the collection of current along the batterysurface. Electrolyte (potassium hydroxide solution with additives) maybe applied to the finished battery to complete construction.

In some embodiments of a wire battery, the layers that are used to formthe battery may have an ability to evolve gasses. In these embodiments,the materials that form the battery layers may have a sealant layerplaced around the battery layers to contain the electrolyte and othermaterials within the confines of the battery and to protect the batteryfrom mechanical stresses. Nevertheless, for embodiments that may evolvegasses, this sealant layer is typically formed in a manner that allowsthe diffusion of the evolved gasses through the layer. In someembodiments, such a sealant layer may include silicone or fluoropolymercoatings; however, any material which is used in the state of the art toencapsulate batteries of this type may define embodiments within thescope of the art defined herein.

Components of Stacked Multilayer Interconnection

As mentioned in prior description, the layers of a stacked integratedcomponent device may typically have electrical and mechanicalinterconnections between them. Some embodiments have been describedwhere certain interconnection schemes, as for example wire bonds, areincluded in sections preceding this discussion. Nevertheless, it may behelpful to summarize some of the types of interconnection in their ownright to help in explanation of the art.

One of the common types of interconnection embodiments derives from theuse of a “solder ball.” A solder ball interconnection is a type ofpackaging interconnection that has been used for decades in thesemiconductor industry, typically in so-called “flip chip” applicationswhere chips are connected to their packaging by inverting a dicedelectronic “chip,” that has deposited solder balls on itsinterconnections, onto a package that has aligned connection pads toconnect to the other side of the solder ball. Heat treatment may allowthe solder ball to flow to a certain degree and form an interconnection.The state of the art has continued its progress so that the solder balltype of interconnection may define an interconnection scheme that occurson either or both sides of a layer. Additional improvement has occurredto decrease the dimension of solder balls that may reliably be used toform interconnections. In some embodiments, the size of the solder ballmay be 50 microns in diameter or smaller.

When a solder ball interconnection is used between two layers, or moregenerally when an interconnection scheme is used that creates gapsbetween two layers, some embodiments use a process step of “underfill”to place adhesive material into the gaps to provide adhesive mechanicalconnection and mechanical support of the two layers. There are numerousmanners to underfill a set of layers that have been interconnected. Insome manners the underfill adhesive is pulled into the gap area bycapillary action. In other embodiments, the underfill adhesive may bemade to flow into a gap by pressurizing the liquid into the gap region.Still other embodiments may derive by forming an evacuated state in thegap area by pulling a vacuum upon the layered device and then followingthis with application of the underfill material. Any of the numerousmanners to underfill a gap in two layered materials are consistent withthe art herein described.

Another evolving technology of interconnection relates tointerconnection of one side of a layered component to the other side bya via that cuts through the layer—such a feature is typically called athrough via. The technology has also been around for decades in variousforms, however the state of the art has improved where very small viasin the 10 micron or less diameter dimension are possible with extremelylarge aspect ratios possible as well, especially when the layeredmaterial is formed of Silicon. Regardless of the layer material, athrough via may form an electrical interconnection between the twosurfaces of a layer with a metallic; however, when the layer is aconductive or semiconductive material, the through via must have aninsulator layer insulating the metallic interconnection from the layeritself. In some embodiments the through via may penetrate through theentire layered substrate. Other embodiments may have the through viapenetrate the substrate but then intersect with a deposited feature onthe surface of the substrate; from the back side.

In some embodiments of through vias where the via intersects with ametal pad on one side of the layer that metal pad may be interconnectedto a different layer with numerous manners including solder balls andwire bonds. In other embodiments where the via is filled with metal andpenetrates the entire layered substrate it may be useful forinterconnections to be formed by solder balls on both sides of theinterconnecting via.

Another embodiment of interconnection occurs when a layer is formedwhich only has through vias and metal routing line upon it. In somecases, such an interconnection device may be called an interposer. Sincethe interposer layer may only have metal routings and viainterconnections there are some additional materials that the layer maybe made of and therefore alternative embodiments for how to createthrough vias in these materials may derive. As a non-limiting example, asilicon dioxide or quartz substrate may be the material of the layer. Insome cases this quartz layer may be formed by pouring melted quartz upona substrate where metallic filaments protrude from the surface. Theseprotrusions then form the metallic connections between the top andbottom surface of the quartz layer that results from this type ofprocessing. The numerous manners of forming thin interconnecting layerscomprise art useful in interconnecting stacked layers and therefore inthe forming of stacked integrated component devices.

Another type of interconnection element is derived from the throughsubstrate via art. If a through substrate via is filled with variouslayers including metal layers the resulting via may form a structurethat can be cut. In some embodiments the via may be cut or “diced” downits center forming a cut out half via. Some embodiments of this type maybe termed castellation interconnections. Embodiments of these typesprovide connection from a top surface to a bottom surface and theability of interconnections from these surfaces; but as well thepotential for interconnection from the side may derive from thestructure of the “Castellation.”

A number of interconnection and component integration technologies havebeen discussed herein and in a general perspective these may relate toembodiments that are within the scope of the inventive art herein.Nevertheless, the invention disclosed herein is intended to embrace awide diversity of integration technologies and the examples, which areintended for illustration purposes, are not intended to limit the scopeof the art.

Stacked Integrated Component Devices with Energization

Proceeding to FIG. 11, item 1100 an exemplary embodiment shows a StackedIntegrated Component Device with energization where there are 8 stackedlayers present. There is a top layer 1110, which acts as a wirelesscommunication layer. There is a technology layer 1115, which connects tothe top layer 1110 and to an interconnect layer 1125 below it.Furthermore, there are 4 battery layers depicted as item 1130. In someembodiments, there would be a lower substrate layer, item 1135 where thesubstrate includes an additional antenna layer. There may be numerousfunctions that an embodiment like this could perform.

Multiple Energization Elements in Stacked Integrated Component Devices

Proceeding now to FIG. 12, item 1200, a schematic representation of anembodiment of the type shown in FIG. 11 may be seen. The multipleenergization elements that were identified as items 1130 in FIG. 11 arenow represented by individual identifiers. It may be apparent that thenumber and organization of the multiple elements are but one of manydifferent arrangements and are depicted for illustrative purposes.Nevertheless, in some embodiments, as shown the elements may be arrangedin 4 banks of 3 or 4 elements as shown by items 1210-1224. A first bankof elements, in this example, therefore may include 1210, 1211, 1212,and 1213. A second bank of elements may include items 1214, 1215, 1216and 1217. A third bank of elements may be represented by elements 1218,1219, 1220 and 1221. In addition, a forth bank of elements may berepresented by elements 1222, 1223 and 1224. In this example the forthbattery element in the fourth bank may not be connected, but may ratherbe used as an interconnection element through the battery element to theantenna element item 1291.

In some embodiments, each of these banks may share a common ground linefor the three or four elements that are connected in the bank. Forillustrative purposes, bank one, including items 1210, 1211, 1212 and1213 may share a common ground line shown as item 1230. Additionally,each of the elements may then have a separate line connecting them tothe interconnect layer which may be represented by the circuit element1290. It may be clear that numerous differences in the connection, countand in fact the make-up of each battery element may comprise art withinthe scope of this inventive art. Moreover, it may be possible that eachbattery element has both a common and a biased electrode separatelyconnected to the interconnect layer.

As mentioned, in some embodiments of the type shown in item 1200, wherebanks of battery elements share a common ground that battery element1213 may share the common bank a common connection, item 1230 and alsohave its own bias connection of item 1235. These connections mayinterface with the interconnection element 1290 and then continue on tothe power management element identified in this figure as item 1205. Thetwo connections may have corresponding input connections into the powermanagement unit where 1240 may be a continuation of the bank a commonground connection 1230 and item 1245 may be a continuation of thebattery element 1213 bias connection 1235. Thus, the individual batteryelement may be connected to the power management entity and switches maycontrol how it is electrically connect to further elements.

In some embodiments, the four banks of fifteen multiple energizationunits may all in fact be connected in a parallel fashion generating araw battery power supply that has the same voltage condition of thebattery elements and a combined battery capacity of the fifteen units.The power management unit, 1205, may connect each of the fifteenelements 1210-1224 in such a parallel fashion. In alternativeembodiments, the power management element may refine and alter the inputpower to result in a refined power output that will be supplied to therest of the stacked integrated component device. It may be apparent thatnumerous electrical refinements may be performed by the power managementelement, including in a non-limiting sense regulating all the elementsto match a standard reference voltage output; multiplying the voltage ofthe individual elements, regulating the current outputted by thecombined battery elements and many other such refinements.

In some embodiments, whatever conditioning of the power conditions ofthe combination of 15 elements may be performed, the raw output of thepower management unit may be connected to the interconnection layer asshown by element 1250. This power supply may be passed through theinterconnection device and electrically fed to the integrated passivedevice element 1206.

Within the integrated passive device element, 1206 there may becapacitors. The raw power supply connection that comes from theinterconnect 1255 may be used to charge the capacitors to the voltagecondition of the raw power supply. In some embodiments, the charging maybe controlled by an active element, in other embodiments it may just bepassed onto the capacitor element. The resulting connection of thecapacitor may then be identified as a first power supply condition forthe stacked integrated component devices as indicated as element 1260 initem 1200. While the storing of energy in capacitors may in someembodiments be carried out in a separate integrated passive deviceelement, in this case depicted as item 1206, in other embodimentscapacitors may be included as part of the power management device itselfor on the other components that are drawing power from the powermanagement device. As well, in some additional embodiments there may acombination of capacitors in the integrated passive devices as well ascapacitors in the power management element and in the elements thatotherwise draw current in the stacked integrated component device withenergization.

There may be numerous motivations for conditioning the power provided bymultiple energization units. An exemplary motivation, in someembodiments may derive from the power requirements of the componentsthat are connected. If these elements have different operating statesthat require different current conditions, then the current draw of thehighest operating state current draw may be buffered by the presence ofthe capacitors. Thus, the capacitors may store significantly morecurrent capacity then the fifteen elements may be able to provide at agiven point in time. Depending on the conditions of the current drawingelement and of the nature of the capacitors in the IPD item 1206 theremay still be a limitation of the amount of time a transient high currentdrawing state may occur for. Since the capacitors would need to berecharged after such a draw on their current capacity, it may be obviousas well that there would need to be a sufficient time betweenreoccurrences of the high current draw condition. Therefore, it may beclear that there could be a large number of different design aspectsrelating to the number of energization units, their energy capacities,the types of devices they connect to and the design power requirementsof the elements that are provided energy by these energization elements,the power management system and the integrated passive devices.

Voltage Supply Aspects of Multiple Energization Units:

In some examples of stacked integrated component devices with multipleenergization units, the combination of the batteries into differentseries and parallel connections may define different embodiments. Whentwo energization units are connected in a series manner the voltageoutput of the energization elements add to give a higher voltage output.When two energization units are connected in a parallel manner thevoltage remains the same but the current capacities add. It may beapparent that in some embodiments, the interconnection of energizationelements may be hardwired into the design of the element. In otherembodiments however, the elements may be combined through use ofswitching elements to define different power supply conditions that maybe dynamically defined.

Proceeding to FIG. 13, item 1300 an example of how switches may be usedto define up to 4 different voltage supplies from the switchedcombination of four different energization elements is shown. It may beapparent, that the number of elements is provided in an exemplary senseand that many different combinations would define similar art within thespirit of the inventive art herein. As well, items 1301, 1302, 1303 and1304 may define the ground connections of four different energizationelements, or in some embodiments these may represent the groundconnections of four different banks of energization elements as wasdemonstrated in the description of FIG. 12. In an exemplary sense, items1305, 1306, 1307 and 1309 may define bias connections to each of thefour depicted energization elements where the bias connection may assumea nominal voltage condition which may be 1.5 volts higher than theindividual element ground connections, 1301,1302, 1303 and 1304.

As shown in FIG. 13, there may be a microcontroller, item 1316, that isincluded in the stacked integrated component device which, among itsvarious control conditions may control the number of power supplies thatthe multiple energization units are connected to define. Themicrocontroller in some embodiments, may connect to a switch controller,item 1315, which may index control signal level changes from themicrocontroller into state changes to the individual switches. For easeof presentation, the output of item 1315 is shown as a single item 1390.In this set of embodiments, this signal is meant to represent theindividual control lines that go out to the variety of switches depictedas items 1320 through 1385. There may be numerous types of switches thatare consistent with the spirit of the inventive art herein, however in anon-limiting sense the switches may be mosfet switches in an exemplarysense. It may be apparent that any of the numerous mechanical andelectrical type switches or other switch types that may be controlled byan electrical signal may comprise art within the spirit of the inventiveart herein.

The control of the switches may be used to generate a number ofdifferent voltage conditions according to the circuit embodiment of item1300. As a starting example, the switches may be configured so thatthere are two different voltage conditions defined; both the 1.5 voltcondition shown as item 1313 and the 3 volt condition shown as item1312. There are numerous ways for this to happen, but for example thefollowing manner will be described where two different elements are usedfor each of the voltage conditions. One may consider combining theelements represented by their ground connections of item 1301 and 1302as the 1.5 volt supply elements. For this to occur, item 1305, the biasconnection for the first energization element may be observed to alreadyconnect to the 1.5 volt supply line item 1313. For the secondenergization element bias connection, 1306 to connect to supply line1313 switch 1342 may be turned to a connected state while switches 1343,1344 and 1345 may be configured in a non-connected state. The groundconnection of the second energization element may now be connected tothe ground line, 1314 by activating switch 1330 to define the second, 3volt supply line, item 1312, the common/ground connections of the third,1303 and forth, 1304 elements may be connected to the 1.5 volt supplyline, 1313. For this to be enacted for the third element, switch 1321may be activated, whereas switches 1320 and 1322 may be deactivated.This may cause connection 1303 to be at the 1.5 volt condition ofelement 1313. Switch 1350 may be deactivated in this case. For thefourth element, switch 1340 should be activated. Switch 1341 may also beactivated, however if it is inactive the same condition may exist.Switch 1370 may be deactivated so that the connection to the ground lineis not made.

The bias connections of the third, 1307 and forth elements, 1309 may nowbe connected to the 3 volt power line 1313. For the third elementconnection, switch 1363 should be active while switches 1362, 1364 and1365 may be inactivated. For the fourth element 1309, switch 1383 may beactive while switches 1382, 1384 and 1385 may be inactive. This set ofconnections may define one of the embodiments that may result in such atwo level (1.5 and 3 Volt) rough power supply condition through theexemplary use of 4 energization units.

The embodiments that may derive from the connections illustrated in FIG.13, item 1300 may result in a number of different power supplyconditions that may result from the use of four energization elements orfour banks of energization elements. It may be apparent that many moreconnections of energization elements may be consistent with theinventive art herein. In a non-limiting sense, there may be as few astwo energization elements or any number more than that which may beconsistent with a stacked integrated component device. In any of theseembodiments, there may be similar concepts for switching the connectionsof the ground and bias side of the energization elements into paralleland series connection which may result in multiples of the energizationvoltage of the individual energization element voltage; if the multipleenergization elements are of the same type, or in combination voltagesif different types and voltages of individual energization elements areincluded in a multiple energization elements embodiment.

The description of a type of embodiment utilizing the switchinginfrastructure of FIG. 13 may in some embodiments describe a set ofconnections that may be programmed into a Stacked Integrated componentdevice and then utilized for the lifetime of the resulting deviceembodiment. It may be clear to one skilled in the art that alternativedynamic embodiments may exist. For example, a stacked integratedcomponent device may have operational modes programmed where the numberor nature of its power supplies may dynamically change. In anon-limiting exemplary sense, referring to FIG. 13, item 1310 mayrepresent a power supply line of the device where in some modes it isnot connected to any energization element connections as may be the caseif switches 1345, 1365 and 1385 are in a non-activated connection. Othermodes of embodiments of this type may result in the connection of one ormore of switches 1345, 1365 and 1385 resulting in a defined energizationvoltage for the power supply of item 1310. This dynamic activation of aparticular voltage may also include deactivation at a later time oralternatively a dynamic change to another operating energizationvoltage. There may be a significant diversity of operational embodimentsthat may derive from the inventive art herein when stacked integratedcomponent devices are included with multiple energization elements whichmay be connected in static and dynamic manners to other elements of thestacked integrated component device.

Self-Testing and Reliability Aspects of Multiple Energization Units:

The nature of energization elements may include aspects where when theelements are assembled into stacked integrated component devices theymay have failure modes that may have the nature of an initial or “timezero” failure or alternatively be an aged failure where an initiallyfunction element may fail during the course of its use. Thecharacteristics of stacked integrated component devices with multipleenergization elements allow for embodiments of circuitry and designwhich allow for remediating such failure modes and maintaining afunctional operational state.

Returning to FIG. 12, item 1200 some embodiments of self-testing andrepair may be illustrated in an exemplary sense. Consider an embodimenttype where the fifteen multiple energization elements, 1210 to 1224 areall connected in a parallel manner to define one power supply conditionbased on the standard operating voltage of each element. As mentioned,the nature of combining these multiple number of energization may allowthe Stacked Integrated Component Device to perform self-testing andrepair if an energization unit is defective or becomes defective.

Proceeding to FIG. 14, item 1400 with the embodiment described above inmind, a sensing element may be used to detect the current flowingthrough the energization devices, depicted as item 1410. There may benumerous ways to set a condition in the stacked integrated componentdevice where its current may be at a standard value. In an exemplarysense, the device could have a “Sleep mode” that it activates where thequiescent current draw is at a very low value. The sensing protocol maybe as straightforward as inserting a resistive element into the powersupply ground return line; although more sophisticated means ofmeasuring current flow including magnetic or thermal transducers or anyother means of performing electrical current metrology may be consistentwith the spirit of the art herein. If the diagnostic measurement of thecurrent flow; in some embodiments represented as a voltage drop throughthe resistive element compared to a reference voltage is found to exceeda standard tolerance then the exemplary self-test circuitry may proceedto determine if one of the energization elements is causing theexcessive current draw condition. In proceeding, one exemplary manner ofisolating the cause, as shown in item 1420 may be to first cycle throughisolating one of the four banks at a time by disconnecting its groundreturn line. Referring back to FIG. 12, item 1200 for example the bankof elements 1210,1211, 1212 and 1213 may be the first bank to beisolated. Ground line 1230 may be disconnected. The same electricalcurrent draw metrology may next be performed after the isolation asshown by item 1430. If the current sensed has now returned to a normalcurrent draw then the problem may be indicated to occur in that bank.If, alternatively, the current still remains out of a specifiedcondition then the logical looping process can proceed to the next bankand back to item 1420. It may be possible that after looping through allthe banks, which in this exemplary sense may be four banks, that thecurrent draw is still outside of the normal tolerance. In such a case,in some embodiments, the self-testing protocol may then exit its test ofthe energization elements and then either stop self-testing or initiateself-testing for some other potential current draw issue. In describingthis self-testing protocol, it may be apparent that an exemplaryprotocol has been described to illustrate the concepts of the inventiveart herein and that numerous other protocols may result in a similarisolation of individual energization units which may be malfunctioning.

Proceeding with the exemplary protocol, when the current flow returns toa normal specification when a bank has been isolated a next isolationloop may be performed in some embodiments. As shown in item 1440, theindividual bank may again be activated however each of the fourelements, for example 1210, 1211, 1212 and 1213 may have their biasconnection disconnected, where for example 1235 may represent the biasconnection of element 1213. Again, after an element is isolated, thecurrent draw may again be sensed as shown in item 1450. If the isolationof an element returns the current draw to a normal state then thatelement may be indicated as defective and disconnected from the powersupply system. In such cases, the self-test protocol may in someembodiments, return item 1460, to its initial state (With the defectiveelement now shut off) and retest that the current is within spec.

If the second looping process as shown by elements 1440 and 1450proceeds through all energization elements in a bank without the currentreturning to an acceptable value the loop may end as shown by element1441. In such an event, the self-test circuitry may then proceed todisable the entire bank from the power supply system, or in otherembodiments it may proceed with a different manner of isolating elementsin the bank; which for this example is not depicted. There may benumerous manners to define self-diagnostic protocols for multipleenergization units and the actions that are programmed to occur based onthese protocols. Simultaneous Charging and Discharging in MultipleEnergization Units

Proceeding now to FIG. 15 item 1500, another set of embodiments that mayresult from integrating multiple energization elements into stackedintegrated component devices may be seen. In some embodiments, wherethere are multiple energization elements, items 1511 to 1524, and thereare elements within the stacked integrated device, 1500, which may beuseful for recharging an energization element, there may be the abilityto charge some of the elements which the remainder of the elements aresimultaneously being used to power components which are functioning.

In an exemplary set of embodiments, a stacked integrated componentdevice containing multiple energization elements may be capable ofreceiving and processing rf signals from an antenna, 1570, comprisedwithin its device. In some embodiments, there may exist a secondantenna, item 1560, which is useful for receiving wireless energy fromthe environment of the device and passing this energy to a powermanagement device, item 1505. In an exemplary sense, there may beincluded a microcontroller element, item 1555 which is both drawingpower from the stacked integrated component device's energization unitsand also controlling the operations within the device. Thismicrocontroller, 1555, may process input information to it usingprogrammed algorithms to determine that the energization system of thefifteen elements, 1511 to 1524, may have enough energy to support thepower requirements of the current device function where only a subset ofthe elements are being used to power the supply controlling circuitry,item 1540, of the power management device and the resulting power supplyto the rest of the components that this circuitry defines. In suchexemplary embodiments, the remaining elements may then be connected tothe charging circuitry, item 1545, of the power management componentwhich may be receiving the power, as mentioned previously, that is beingreceived by antenna 1560. In the embodiment depicted in FIG. 15 item1500, for example the stacked integrated component device may be placedinto a state where three of the multiple energization elements, items1522, 1523 and 1524 may be connected as for example shown form item 1523as item 1150, to the charging electronics. Simultaneously, the remaining12 elements, items 1511 to 1521 may be connected to the supplycircuitry, 1540 as is shown for example for element 1511 as item 1530.In this manner, a stacked integrated component device with energizationmay be enabled, through the use of multiple energization elements tooperate in modes where the elements are both being charged anddischarged simultaneously. The depiction of this exemplary simultaneouscharging and discharging mode is provided as but one of numerous mannersthat multiple energization elements may be configured to performmultiple functions within a stacked integrated component device withenergization, and it is not intended that such an example limits in anyway the large diversity of embodiments that may be possible.

The invention claimed is:
 1. A stacked integrated component device withmultiple energization elements for an ophthalmic lens including poweredcomponents, comprising: a first layer comprising a first surface; asecond layer comprising a second surface, wherein at least a portion ofthe first layer lays above at least a portion of the second layer suchthat they overlap only partially and form a three dimensional structureconfigured to match a profile of the ophthalmic lens; at least oneelectrical connection between a first electrical contact on the firstsurface and a second electrical contact on the second surface; at leastone electrical transistor, wherein the at least one electricaltransistor is located within the stacked integrated component device;and at least a first and a second discrete energization element locatedwithin at least one of the first layer and the second layer.
 2. Thestacked integrated component device of claim 1, wherein the first andthe second discrete energization elements each have a thicknesses ofless than 200 microns.
 3. The stacked integrated component device ofclaim 1, additionally comprising: a first electrical common connectionin contact with a first ground connection of the first discreteenergization element; a second electrical common connection in contactwith a second ground connection of the second discrete energizationelement; a first electrical bias connection in contact with a first biasconnection of the first discrete energization element; and a secondelectrical bias connection in contact with a second bias connection ofthe second discrete energization element.
 4. The stacked integratedcomponent device of claim 3, wherein the first electrical commonconnection is electrically connected to the second electrical commonconnection forming a single common connection for the first and thesecond discrete energization elements.
 5. The stacked integratedcomponent device of claim 4, wherein the first electrical biasconnection is electrically connected to the second electrical biasconnection forming a single bias connection for the first and the seconddiscrete energization elements.
 6. The stacked integrated componentdevice of claim 3, wherein: the first electrical bias connection iselectrically connected to a first power supply input of a firstintegrated circuit; and the second electrical bias connection iselectrically connected to a second power supply input of the firstintegrated circuit.
 7. The stacked integrated component device of claim6, wherein: the first integrated circuit generates a first output powersupply; and a second integrated circuit is electrically connected to thefirst output power supply.
 8. The stacked integrated component device ofclaim 7, wherein: the first integrated circuit combines, with at least afirst switch, the first power supply input and the second power supplyinput to create the first output power supply, the first output supplyhaving a voltage capability equivalent to the first and the seconddiscrete energization elements, and the first output supply having acombined electrical current capability of the first and the seconddiscrete energization elements.
 9. The stacked integrated componentdevice of claim 7, wherein: the first integrated circuit combines, withat least a first switch, the first power supply input and the secondelectrical common connection to create the first output power supply,the first output supply having a current capability of the lesser of theelectrical current capability of the first and the second discreteenergization elements, and the first output supply having a combinedelectrical bias of the first and the second discrete energizationelements.
 10. The stacked integrated component device of claim 7,wherein each of the electrical connections from the first layer and thesecond layer are not connected to an external wired connection of thestacked integrated component device.
 11. The stacked integratedcomponent device of claim 1, additionally comprising at least a thirdand a fourth discrete energization element located within the stackedintegrated component device.
 12. The stacked integrated component deviceof claim 1, wherein the discrete energization elements create more thanone raw power supply.
 13. The stacked integrated component device ofclaim 12, wherein at least a first raw power supply is electricallyconnected to a capacitive element separate from the discreteenergization elements.
 14. A stacked integrated component device withmultiple energization elements for an ophthalmic lens including poweredcomponents, comprising: a first layer comprising a first surface, and asecond layer comprising a second surface, wherein at least a portion ofthe first layer lays above at least a portion of the second layer suchthat they partially overlap and form a three dimensional structureconfigured to match a profile of the ophthalmic lens; at least oneelectrical connection between a first electrical contact on the firstsurface and a second electrical contact on the second surface; at leastone electrical transistor, wherein the at least one electricaltransistor is located within the stacked integrated component device;and at least a first and a second discrete energization element locatedwithin at least one of the first layer and the second layer, wherein thefirst and the second discrete energization elements simultaneouslyprovide power.
 15. The stacked integrated component device of claim 14,wherein the first discrete energization element is located within thefirst layer and the second discrete energization elements is locatedwithin the second layer.
 16. The stacked integrated component device ofclaim 14, wherein the first and the second discrete energizationelements are both located in either one of the first layer and thesecond layer.
 17. The stacked integrated component device of claim 14,wherein the first discrete energization element generates a first rawbattery power and the second discrete energization element generates asecond raw battery power.
 18. The stacked integrated component device ofclaim 17, additionally comprising a power management unit electricallyconnected to the first and the second discrete energization elements,wherein the power management unit receives the first raw battery powerfrom the first discrete energization element and the second raw batterypower from the second discrete energization element.
 19. The stackedintegrated component device of claim 18, wherein the power managementunit refines and alters the first raw battery power and the second rawbattery power resulting in a refined power output.
 20. The stackedintegrated component device of claim 19, additionally comprising anintegrated passive device in electrical connection with the powermanagement unit, wherein the integrated passive device comprises anumber of capacitors connected to at least one of the discreteenergization elements.
 21. The stacked integrated component device ofclaim 20, wherein the integrated passive device holds the refined poweroutput provided by the power management unit.
 22. The stacked integratedcomponent device of claim 14, additionally comprising a microcontrollerlocated within the stacked integrated component device controlling thediscrete energization elements.
 23. The stacked integrated componentdevice of claim 22, additionally comprising a switch controller inelectrical connection with the microcontroller, wherein the switchcontroller is configured to change a state of each of a plurality ofswitches in response to a signal from the microcontroller.
 24. Thestacked integrated component device of claim 23, wherein the switchescontrol a number of different voltage conditions for the stackedintegrated component device.
 25. The stacked integrated component deviceof claim 23, wherein the microcontroller determines whether at least oneof the discrete energization elements generates enough power to supporta power requirement of the stacked integrated component device.
 26. Thestacked integrated component device of claim 25, additionally comprisinga first and a second antenna, wherein the first antenna is capable ofreceiving radio frequency signals and the second antenna is capable ofreceiving wireless energy from an environment of the stacked integratedcomponent device.
 27. The stacked integrated component device of claim23, additionally comprising a plurality of sets of discrete energizationelements, wherein a first set of discrete energization elements isconnected to only one of a plurality of voltage supply lines and each ofthe remaining sets of discrete energization elements is connected toeach of the voltage supply lines.
 28. The stacked integrated componentdevice of claim 27, wherein each of the remaining sets of discreteenergization elements is connected to each of the voltage supply linesby a separate switch.
 29. The stacked integrated component device ofclaim 27, wherein each set of discrete energization elements is alsoconnected to a plurality of switches, wherein each of the switchesconnects to a bias connection of each of the remaining sets of discreteenergization elements.
 30. The stacked integrated component device ofclaim 26, wherein the first antenna is electrically connected to thediscrete energization elements and the second antenna is connected to anintegrated passive device element.